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Title:
光リンクモジュールおよびその製造方法
Document Type and Number:
Japanese Patent JP4755037
Kind Code:
B2
Abstract:

To provide an optical link module in which high positioning precision of an optical fiber and an optical semiconductor element is assured and a structure for an efficient assembly is furnished and to provide a method for manufacturing the optical link module.

The optical link module 1 is provided with a premold case 20 and a cap member 2. The premold case 20 has an element mounting part provided with the optical semiconductor element on a case body part and a mount receiving part which is arranged outside the optical semiconductor element in the element mounting part and to which a cap member 2 is mounted. The cap member 2 has a fiber guide part 4 to which an optical fiber is inserted and a mount part which is mounted on the mount receiving part and arranged on the back face side of the fiber guide part 4. The optical link module 1 has a space part 10 between the premold case 20 and the cap member 2 for changing the position of the cap member 2 on the premold case 20 while the mount part is mounted on the mount receiving part.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Takayuki Suzuki
Application Number:
JP2006196018A
Publication Date:
August 24, 2011
Filing Date:
July 18, 2006
Export Citation:
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Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
G02B6/42; H01L31/0232; H01S5/022
Domestic Patent References:
JP7288332A
JP6060807U
JP2004264640A
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Kazuyuki Shirai