Title:
電気メッキ装置
Document Type and Number:
Japanese Patent JP4755729
Kind Code:
B1
Abstract:
A processed product is continuously partially plated without being covered. Electroplating is carried out on a portion other than a head of a processed product also having a lower part and a constricted part between the head and the lower part. A pair of rails has an opening between the rails narrower than the head and broader than the constricted part, and electrodes are arranged thereon. A plating bath is positioned below the rails, and electrode plates are arranged in a plating solution. The constricted part of the processed product is positioned at the opening between the rails, and a pushing element extending from above the rails through the opening contacts the processed product at a position lower than the center of gravity at the lower part. The pushing element is displaced along the rails to plate a portion of the processed products positioned below the rails.
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Inventors:
Hiroo Otsuka
Application Number:
JP2011038199A
Publication Date:
August 24, 2011
Filing Date:
February 24, 2011
Export Citation:
Assignee:
Otsuka Metal Co., Ltd.
International Classes:
C25D17/06; C25D5/02
Domestic Patent References:
| JPS5751286A | 1982-03-26 | |||
| JPS62141072A | 1987-06-24 | |||
| JP2007023348A | 2007-02-01 |
Attorney, Agent or Firm:
Tsuguhisa Takuma