チップ体製造用粘着シート

Title:

チップ体製造用粘着シート

Document Type and Number:

Japanese Patent JP4757442

Kind Code:

B2

Abstract:

To provide a manufacturing method of a chip body in which a space between chips is expanded without a conventional expanded process in a process for manufacturing a chip body such as a semiconductor chip, and an adhesive sheet for manufacturing the chip body used properly in the manufacturing method.

The adhesive sheet for manufacturing a chip body has an adhesive layer for sticking a material that is cut, a shrinkable film, and an extensible film stacked, in this order. Preferably, the extensible film has an elastic modulu of less than 1×109N/m2, the adhesive layer comprises a radiation curing adhesive, and the heat-shrinkable film and the extensible film are stacked via an adhesive layer having an elastic modulus of not less than 1.0×105N/m2.

Inventors:

Noguchi Hayato
Kazuyoshi Ebe

Application Number:

JP2003418496A

Publication Date:

August 24, 2011

Filing Date:

December 16, 2003

Export Citation:

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Assignee:

LINTEC CORPORATION

International Classes:

C09J7/02; H01L21/301; C09J201/00; H01L21/52

Domestic Patent References:

JP7273173A
JP8316177A
JP8302293A
JP63205924A
JP1116606U
JP61081652A

Attorney, Agent or Firm:

Koji Makimura
Chihata Takahata
Toru Suzuki

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