Title:
基板層切断装置及び方法
Document Type and Number:
Japanese Patent JP4757444
Kind Code:
B2
Abstract:
An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.
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Inventors:
Olivier, Lysac
Fabrice, Luthere
Fabrice, Luthere
Application Number:
JP2003559738A
Publication Date:
August 24, 2011
Filing Date:
January 02, 2003
Export Citation:
Assignee:
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
International Classes:
B28D1/22; B28D5/00; H01L21/20; H01L21/762
Domestic Patent References:
| JP2000188269A | 2000-07-04 | |||
| JPH02263437A | 1990-10-26 | |||
| JP2000091304A | 2000-03-31 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Satoshi Nazuka
Junpei Okada
Hideyuki Mori
Yukihiro Hotta
Hiroyuki Nagai
Katsuomi Isogai
Satoshi Nazuka
Junpei Okada
Hideyuki Mori
Yukihiro Hotta