Title:
非接触IC装置及び制御方法
Document Type and Number:
Japanese Patent JP4757542
Kind Code:
B2
Abstract:
A non-contact IC apparatus is provided. A non-contact IC apparatus has a mounting portion on which a plurality of IC chips can be mounted; an antenna for receiving a radio wave for non-contact IC apparatus; signal acquiring means for acquiring a signal from the radio wave received by the antenna; and distribution controlling means for selecting an IC chip to receive the signal, out of a plurality of IC chips mounted on the mounting portion, based on the signal acquired by the signal acquiring means, and for transmitting the signal to the selected IC chip.
Inventors:
Hidetoshi Ishikawa
Koji Chiba
Koji Chiba
Application Number:
JP2005169730A
Publication Date:
August 24, 2011
Filing Date:
June 09, 2005
Export Citation:
Assignee:
NTT DoCoMo, Inc.
International Classes:
G06K19/07; B42D15/10; G06K19/08; H04M1/72412
Domestic Patent References:
| JP9167217A | ||||
| JP2003022429A | ||||
| JP2001527725A | ||||
| JP2004334682A | ||||
| JP2002342725A | ||||
| JP9074384A | ||||
| JP2000172806A | ||||
| JP2003133787A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Tomoya Kurokawa
Yuji Suwa
Takashi Okiyama
Shiro Terasaki
Tomoya Kurokawa
Yuji Suwa
Takashi Okiyama