Title:
基板加熱装置
Document Type and Number:
Japanese Patent JP4761723
Kind Code:
B2
Abstract:
A substrate heating device is provided, including a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate corresponding to a plurality of zones into which the heating surface is divided, terminals respectively connected to the resistance heating elements, and lead wires respectively connected to the terminals and wired on an outer surface of the ceramic base plate other than the heating surface.
Inventors:
Yoshinobu Goto
Hideyoshi Tsuruta
Hideyoshi Tsuruta
Application Number:
JP2004117237A
Publication Date:
August 31, 2011
Filing Date:
April 12, 2004
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L21/02; H05B3/20; F23Q7/22; H01L21/00; H01L21/68; H01L21/683; H05B3/02; H05B3/10; H05B3/12; H05B3/74
Domestic Patent References:
| JP2004031593A | ||||
| JP2001358205A |
Attorney, Agent or Firm:
Aitec International Patent Office
Nakamura Tomoyuki
Nakamura Tomoyuki