Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP4767090
Kind Code:
B2
More Like This:
Inventors:
Taiji Sakai
Masataka Mizukoshi
Masataka Mizukoshi
Application Number:
JP2006151258A
Publication Date:
September 07, 2011
Filing Date:
May 31, 2006
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/60
Domestic Patent References:
| JP6283537A | ||||
| JP2000235990A | ||||
| JP5013419A | ||||
| JP2002093852A | ||||
| JP11214431A | ||||
| JP2000022300A | ||||
| JP2004319699A |
Foreign References:
| WO2005069364A1 |
Attorney, Agent or Firm:
Takeshi Hattori