Title:
無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP4771100
Kind Code:
B2
Abstract:
A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25°C and is free of a solvent.
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Inventors:
Yoshinori Yoneda
Michihiro Sugo
Michihiro Sugo
Application Number:
JP2008218318A
Publication Date:
September 14, 2011
Filing Date:
August 27, 2008
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L79/08; C08G73/10; C08L63/00
Domestic Patent References:
| JP2005113059A | ||||
| JP2009511717A | ||||
| JP200968008A | ||||
| JP200968002A | ||||
| JP200973875A | ||||
| JP200751215A |
Foreign References:
| WO2008139990A1 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa