Title:
圧力制御された熱源及びRTP用処理を用いるための方法
Document Type and Number:
Japanese Patent JP4771226
Kind Code:
B2
Abstract:
A thermal device with a container having a surface exposed to the substrate, wherein the container further has a heat source and a plurality of thermal shields situated between the surface exposed to the substrate and the heat source. The thermal shields are spaced from one another by a predetermined distance defining one or more gaps therebetween, wherein the predetermined distance is associated with a mean free path of a gas residing therein. Alternatively, the predetermined distance is variable. A pressure of a gas residing within the one or more gaps is controlled, wherein the pressure of the gas switches the thermal conductivity of the gas between generally conductive and generally non-conductive.
Inventors:
Peter Kellerman
Frederick Carlson
Frederick Carlson
Application Number:
JP2006533542A
Publication Date:
September 14, 2011
Filing Date:
May 28, 2004
Export Citation:
Assignee:
Axcelis Technologies, Inc.
International Classes:
H01L21/02; H01L21/00
Domestic Patent References:
| JP2003109954A | 2003-04-11 | |||
| JP2002246325A | 2002-08-30 | |||
| JPH0437700A | 1992-02-07 |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya