Title:
超音波振動子、及び湾曲アレイに対してフリップチップ二次元アレイ技術を実行する方法
Document Type and Number:
Japanese Patent JP4773366
Kind Code:
B2
Abstract:
An ultrasound transducer probe (40) includes a support substrate (54), an integrated circuit (42) and an array of piezoelectric elements (50). The support substrate (54) has a non-linear surface (55). The integrated circuit (42) physically couples to the support substrate (54) overlying the non-linear surface (55), wherein the integrated circuit (42) substantially conforms to a shape of the non-linear surface (55). An array of piezoelectric elements (50) couples to the integrated circuit (42).
Inventors:
Sdoll, Wojek
Application Number:
JP2006542100A
Publication Date:
September 14, 2011
Filing Date:
December 01, 2004
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
B06B1/06; A61B8/00
Domestic Patent References:
| JPH10192281A | 1998-07-28 | |||
| JP2001149865A | 2001-06-05 | |||
| JP2001102651A | 2001-04-13 | |||
| JP2003033414A | 2003-02-04 | |||
| JP2003125494A | 2003-04-25 |
Foreign References:
| US6859984B2 | 2005-03-01 | |||
| US20020087083A1 | 2002-07-04 | |||
| WO2001089723A1 | 2001-11-29 |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito