To provide a relay member which can be applied to the other semiconductor device having a different structure by arbitrarily setting arrangement of bonding pads of the relay member disposed in a semiconductor device and wiring connecting the bonding pads and to provide the semiconductor device having the relay member.

The relay member 50 disposed in the semiconductor device is provided with a first terminal 51 and a second terminal 52. A coupling part 60 is formed by at least one of an end part of first terminal wiring 56 connected to the first terminal 51 and an end part of second terminal wiring 57 connected to the second terminal. A connection member 61 is formed at least in the coupling part 60 and the first terminal 51 is connected to the second terminal 52.

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