Title:
はんだ槽の侵食軽減ツール及びこれを備えたはんだ付装置
Document Type and Number:
Japanese Patent JP4777674
Kind Code:
B2
Abstract:
To provide a tool for reducing the erosion of a solder bath caused by arsenic contained in lead-free solder.
The erosion reducing tool 12 for reducing the erosion of the solder bath 11 due to the arsenic contained in the solder is arranged in the bath of molten solder S. The erosion reducing tool is a plate having a chrome plated film 122 formed on the surface of iron 121. Because the chrome plated film 122 is made of pure chrome, the chrome plated film 122 can collect the arsenic more than the stainless steel of the solder bath 11 containing few chrome.
COPYRIGHT: (C)2006,JPO&NCIPI
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Inventors:
Teruo Okano
Masataka Iijima
Shunichi Yoshida
Tadashi Takemoto
Hiroshi Nishikawa
Masataka Iijima
Shunichi Yoshida
Tadashi Takemoto
Hiroshi Nishikawa
Application Number:
JP2005071756A
Publication Date:
September 21, 2011
Filing Date:
March 14, 2005
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
National University Corporation Osaka University
National University Corporation Osaka University
International Classes:
B23K3/06; B23K1/08; B23K3/08; C22C38/00; C22C38/18; H05K3/34; B23K35/26; B23K101/42; C22C13/00
Domestic Patent References:
| JP63215372A | ||||
| JP2005138171A | ||||
| JP59208062A | ||||
| JP2005074478A | ||||
| JP2002336960A |
Attorney, Agent or Firm:
Isamu Takahashi