Title:
耐光性プライマー組成物、該プライマー組成物を用いる発光半導体装置の製造方法、及び該方法により得られる発光半導体装置
Document Type and Number:
Japanese Patent JP4777802
Kind Code:
B2
Abstract:
The invention provides a primer material which has favorable coating property, high adhesion reliability between a sealing resin and a substrate, and high color fastness to light irradiation and heating. The invention also provides a method for producing a light-emitting semiconductor device using the priming paint material. The primer composition contains: (A) at least one silane compound showed by following general formula (1): R<1>XR<2>YSi(R<3>)4-X-Y(1) (wherein, R<1> and R<2> are each independently a hydrogen atom or alkyl containing one or more reactive substituents and 1 to 30 carbon atomics, R<3> is a chlorine atomic, a hydroxyl, or an unsubstituted or substituted alkoxyl or aryloxy containing 1 to 30 carbon atomics, X is an integer of 1 to 2, Y is an integer of 0 to 1, X+Y is an integer of 1 or 2), and/or partial hydrolyzate condensates thereof, (B) a Louis acid organo-aluminium compound and (C) an organic solvent.
Inventors:
Kazuya Arima
Katsuyuki Imazawa
Tsutomu Kashiwagi
Kinya Kodama
Katsuyuki Imazawa
Tsutomu Kashiwagi
Kinya Kodama
Application Number:
JP2006074307A
Publication Date:
September 21, 2011
Filing Date:
March 17, 2006
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09D183/04; C09D5/00; C09D7/12; C09D183/08; C09D185/00; C09K3/10; H01L23/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP5179027A | ||||
| JP6320660A | ||||
| JP2003176460A | ||||
| JP2004026848A | ||||
| JP10050900A |
Attorney, Agent or Firm:
Shuji Iwamiya