Title:
低熱膨張性積層板
Document Type and Number:
Japanese Patent JP4779129
Kind Code:
B2
Abstract:
A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150 DEG C is not higher than 20 x 10<-6>/ DEG C can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
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Inventors:
Rinko Inoue
Hiroya Okumura
Hirata Isao
Shigehiro Okada
Hiroya Okumura
Hirata Isao
Shigehiro Okada
Application Number:
JP2001571804A
Publication Date:
September 28, 2011
Filing Date:
March 23, 2001
Export Citation:
Assignee:
Japan Composite Co., Ltd.
Panasonic Electric Works Co., Ltd.
Panasonic Electric Works Co., Ltd.
International Classes:
C08J5/24; B32B5/26; B32B15/08; B32B27/04; C08F283/01; C08F290/06; C08L35/02; C08L67/00; C08L67/06; H05K1/03
Domestic Patent References:
| JPH08318593A | 1996-12-03 | |||
| JPH08231654A | 1996-09-10 | |||
| JPH08259778A | 1996-10-08 |
Attorney, Agent or Firm:
Yoshitaka Tani
Hiroyuki Okamoto
Hiroyuki Okamoto