Title:
半導体レーザ装置
Document Type and Number:
Japanese Patent JP4786059
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which suppresses overheating due to irradiation of a belt pattern laser beam. SOLUTION: A shaping optical system reflects central portions 201 , 202 of a laser beam away from each other with both end portions transmitted, so that the intensity of a pattern at both ends is relatively higher than that of a center portion. This suppresses the relative overheating of a center portion of a work when the work is irradiated with the laser beam. It uses reflection and transmission, both being a means of high utilization efficiency of light, and hence the intensity attenuation is suppressed.
More Like This:
Inventors:
Hirofumi Miyajima
Hirofumi Suga
Takayuki Uchiyama
Satoshi Oishi
Hirofumi Suga
Takayuki Uchiyama
Satoshi Oishi
Application Number:
JP2001140510A
Publication Date:
October 05, 2011
Filing Date:
May 10, 2001
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01S5/022; H01S5/22; H01S5/40
Domestic Patent References:
| JP7253556A | ||||
| JP2001083460A | ||||
| JP63092083A | ||||
| JP63142887A | ||||
| JP2001111176A | ||||
| JP6339786A | ||||
| JP7250209A | ||||
| JP4284994A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Tatsuya Shioda
Shiro Terasaki
Tatsuya Shioda
Shiro Terasaki