Title:
半導体レーザ装置および光ピックアップ装置
Document Type and Number:
Japanese Patent JP4786350
Kind Code:
B2
Abstract:
A semiconductor laser chip is mounted on one surface of an electrode lead for chip mounting having a heat release region for releasing heat around the semiconductor laser chip. Therefore, it is possible to release heat of the semiconductor laser chip to the chip mounting lead and release the heat from the heat release region, thereby suppressing increase of a temperature of the semiconductor laser chip and suppressing shortening of life of the semiconductor laser chip.
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Inventors:
Osamu Hamaoka
Application Number:
JP2006011694A
Publication Date:
October 05, 2011
Filing Date:
January 19, 2006
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01S5/0232; G11B7/125
Domestic Patent References:
| JP10209491A | ||||
| JP63180962U | ||||
| JP2003069125A | ||||
| JP2003289167A | ||||
| JP2005116700A |
Attorney, Agent or Firm:
Keiichiro Saikyo
Takeshi Sugiyama
Takeshi Sugiyama