Title:
絶縁伝熱構造体及びパワーモジュール用基板並びに絶縁伝熱構造体の製造方法
Document Type and Number:
Japanese Patent JP4797676
Kind Code:
B2
Inventors:
Ryuji Uesugi
Shoro Kuromitsu
Kazuo Yamamoto
Shoro Kuromitsu
Kazuo Yamamoto
Application Number:
JP2006035087A
Publication Date:
October 19, 2011
Filing Date:
February 13, 2006
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/36
Domestic Patent References:
| JP2005236266A | ||||
| JP2005236276A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama
Noriko Yanai
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama
Noriko Yanai