Title:
電子機器用プリント板の製造方法およびこれを用いた電子機器
Document Type and Number:
Japanese Patent JP4799997
Kind Code:
B2
Abstract:
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.
Inventors:
Masayuki Ochiai
Hiroki Uchida
Toshiya Akamatsu
Hiroki Uchida
Toshiya Akamatsu
Application Number:
JP2005310202A
Publication Date:
October 26, 2011
Filing Date:
October 25, 2005
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/34
Domestic Patent References:
| JP2003017847A | ||||
| JP2000307228A | ||||
| JP11179586A | ||||
| JP2001293594A | ||||
| JP2000151086A | ||||
| JP10163624A | ||||
| JP7009659A | ||||
| JP5212852A | ||||
| JP8252688A | ||||
| JP9307223A |
Attorney, Agent or Firm:
Kenji Doi
Hayashi Tsunetoku
Hayashi Tsunetoku