Title:
MEMSデバイスの製造方法
Document Type and Number:
Japanese Patent JP4809838
Kind Code:
B2
Abstract:
A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
Inventors:
Martin, John Earl.
Mena, Manologie.
Laksamana, Elmer S.
Duffy, Michael Pee.
Webster, William A.
Felton, Lawrence E.
Carpman, Maurice S.
Mena, Manologie.
Laksamana, Elmer S.
Duffy, Michael Pee.
Webster, William A.
Felton, Lawrence E.
Carpman, Maurice S.
Application Number:
JP2007524796A
Publication Date:
November 09, 2011
Filing Date:
May 31, 2005
Export Citation:
Assignee:
Analog Devices, Inc.
International Classes:
B81C1/00; H01L21/304
Domestic Patent References:
| JPH07509351A | 1995-10-12 | |||
| JP2001332746A | 2001-11-30 | |||
| JPH07153823A | 1995-06-16 | |||
| JPH08316497A | 1996-11-29 | |||
| JP2002273699A | 2002-09-25 |
Foreign References:
| WO2003054927A2 | 2003-07-03 | |||
| WO2003024865A2 | 2003-03-27 | |||
| WO2002068320A2 | 2002-09-06 | |||
| WO2004035461A2 | 2004-04-29 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita