Title:
半導体基板洗浄剤及び洗浄方法
Document Type and Number:
Japanese Patent JP4821082
Kind Code:
B2
Abstract:
A semiconductor surface cleaning agent containing a compound the molecule of which has a nitrogen atom having an unshared electron pair and used for cleaning the surface of a semiconductor on which copper wiring is provided, and a method for cleaning the surface of a semiconductor characterized by treating the surface of a semiconductor on which copper wiring is provided with such a cleaning agent. The cleaning agent does not corrode the copper wiring (copper thin film) on the semiconductor and SiO2 of the interlayer insulating film, does not impair the flatness of the surface, and is effective in removing CuO and particles adhering to the surface of the Cu-CMP step.
Inventors:
Masahiko Kakizawa
Kimura Mayumi
Hironori Mizuta
Hayashida Kazuyoshi
Kimura Mayumi
Hironori Mizuta
Hayashida Kazuyoshi
Application Number:
JP2001569870A
Publication Date:
November 24, 2011
Filing Date:
March 19, 2001
Export Citation:
Assignee:
Wako Pure Chemical Industries, Ltd.
International Classes:
H01L21/304; C11D7/26; C11D7/32; C11D7/34; C11D7/36; C11D11/00; C11D17/00; H01L21/02; H01L21/321; H01L21/306; H01L21/768
Domestic Patent References:
| JPH1072594A | 1998-03-17 | |||
| JPH07297158A | 1995-11-10 | |||
| JPH03219000A | 1991-09-26 | |||
| JPS50158281A | 1975-12-22 | |||
| JPH08187475A | 1996-07-23 | |||
| JPH1197400A | 1999-04-09 | |||
| JPH11283953A | 1999-10-15 | |||
| JPH0448633A | 1992-02-18 |
Foreign References:
| US5997658A | 1999-12-07 |