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Title:
固体撮像素子の製造方法及び固体撮像素子
Document Type and Number:
Japanese Patent JP4826754
Kind Code:
B2
Abstract:

To obtain a solid-state imaging device having high sensitivity without increasing manufacturing processes.

The method of manufacturing the solid-state imaging device forms, on a substrate, a photodiode for generating optically generated charges corresponding to an incident light, an accumulating section to which the optically generated charges generated in the photodiode are transferred, and a detecting section for detecting a charge quantity of the optically generated charges accumulated in the accumulating section. The method is provided with a first step of introducing one conductivity-type first impurities into the substrate in a forming region of the photodiode; and a second step of discretely introducing another conductivity-type second impurities into a plurality of positions so that an injection quantity per unit area increases in proportion to a distance from the accumulating section, in the forming region of the photodiode.

COPYRIGHT: (C)2008,JPO&INPIT


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Inventors:
Kuwasawa Kazunobu
Application Number:
JP2006080419A
Publication Date:
November 30, 2011
Filing Date:
March 23, 2006
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H01L27/146; H04N5/335; H04N5/369; H04N5/374
Domestic Patent References:
JP2000236081A
JP6097406A
JP10050976A
JP8250446A
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa