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Title:
真空式フラットパネル型太陽熱集熱器を真空密閉ろう付けする装置
Document Type and Number:
Japanese Patent JP4846846
Kind Code:
B2
Abstract:
Device for vacuum tight soldering together a perimeter metal coating (5) of a transparent wall (4) to a perimeter metal frame (3) of a holding structure (2) of an evacuated solar collector (1), in particular a flat solar collector, said collector comprising a joining ribbon (6), preferably a soft metal strip or ribbon, in particular a lead and/or copper strip or ribbon, which is adapted to vacuum tight seal the gap (7) between said transparent wall (4) and said metal frame (3) and which is adapted to be soldered, in particular soft soldered, to said perimeter metal frame (3) and said perimeter metal coating (5) of the transparent wall (4), said joining ribbon comprising a soldering alloy, said device comprising heating means (24) for heating: a first part (5A) of said transparent wall (4) comprising at least a portion of said perimeter metal coating (5), a second part (3A) of said holding structure (2) comprising at least a portion of said perimeter metal frame (3), and said joining ribbon (6) to at least the melting temperature of said soldering alloy, when said transparent wall (4) is positioned in said holding structure (2) with said joining ribbon (6) overlapping at least partially said perimeter metal frame (3) and said metal coating (5), and pressure means (25) for applying at least on said first (5A) and second (3A) parts and said joining ribbon (6) a force which guarantees a mechanical contact of the melted soldering alloy to said metal frames (3) and said metal coating (5) throughout the solidification process of said soldering alloy.

Inventors:
Benvenuchi Cristoforo
Application Number:
JP2009516908A
Publication Date:
December 28, 2011
Filing Date:
June 26, 2006
Export Citation:
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Assignee:
SRB Energy Research Sar
European Organization for Nuclear Research (C/R N)
International Classes:
F24J2/50; F24J2/46
Domestic Patent References:
JP2005265251A
JP59020209U
JP57092663A
JP57036547U
Foreign References:
WO2005075900A1
Attorney, Agent or Firm:
Toshiharu Ogawa
Kenji Izumina
Ryozo Yamamoto



 
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