Title:
半導体装置
Document Type and Number:
Japanese Patent JP4854148
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable a semiconductor device capable of coping with a high speed operation and high-level functions to be reduced in size and weight and improved in electrical properties. SOLUTION: A semiconductor device is equipped with a first semiconductor device 22 and a second semiconductor device 23, solder balls 26, and a board 24 connecting the semiconductor elements 22 and 23 and the solder balls 26. Metal layers 37 and 38 are formed on the surfaces of the semiconductor devices 22 and 23, and power supply pads 33 inside the electrode pads of the semiconductor devices 22 and 23 are electrically connected to the metal layers 37 and 38 respectively.
Inventors:
Ozawa Kaname
Tetsuya Hiraoka
Akira Takashima
Tetsuya Hiraoka
Akira Takashima
Application Number:
JP2001258712A
Publication Date:
January 18, 2012
Filing Date:
August 28, 2001
Export Citation:
Assignee:
Fujitsu Semiconductor Limited
International Classes:
H01L23/12; H01L25/065; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2003007750A | ||||
| JP2000150699A | ||||
| JP51120685A | ||||
| JP56027962A | ||||
| JP8153747A | ||||
| JP1153640A | ||||
| JP7050368A | ||||
| JP53103385A | ||||
| JP60022327A | ||||
| JP10303249A |
Attorney, Agent or Firm:
Tadahiko Ito