Title:
医療用インプラント装置
Document Type and Number:
Japanese Patent JP4869335
Kind Code:
B2
Abstract:
Described are medical devices for supporting or inducing bone growth including an implant body defining one or more separation-assist lines that facilitate separation of the body into two or more substantially pre-defined pieces. The implant body can be used and implanted as a whole or may be separated into multiple pieces, some or all of which can be used at one or multiple implant sites in a patient. Separation-assist lines in implant bodies can serve a dual role in imparting increased and controlled flexibility to the overall body when used as a whole at an implant site. Also described are methods of making and using, and kits including, such medical devices.
Inventors:
McKay, William Eff
Jeffrey El, Schiffert
Jeffrey El, Schiffert
Application Number:
JP2008508927A
Publication Date:
February 08, 2012
Filing Date:
April 19, 2006
Export Citation:
Assignee:
Warsaw Orthopedic Incorporated
International Classes:
A61F2/28; A61L27/00
Domestic Patent References:
| JP2005503861A | 2005-02-10 |
Foreign References:
| WO2004054633A2 | 2004-07-01 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Wataru Kitakita
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Wataru Kitakita