Title:
リペア方法およびリペア治具
Document Type and Number:
Japanese Patent JP4874402
Kind Code:
B2
Abstract:
A repair method for detaching a part from a board in an electronic device module having at least the board and the part bonded with the board by a press fitting process. A repair use block having a repair use through hole is placed on the part, and a repair use bolt is fastened with a repair use female thread formed in the part, in advance, through the repair use through hole. The repair use bolt head abuts against the top surface of the repair use block, then is further fastened, whereupon the part is pulled up together with the repair use female thread upward above the board. When a repair use female thread cannot be directly formed in the part, a repair use auxiliary part which is to be pulled up integrally with the part, is interposed.
Inventors:
Shin Hirano
Application Number:
JP2009546891A
Publication Date:
February 15, 2012
Filing Date:
December 21, 2007
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/34
Domestic Patent References:
| JP2002164141A | ||||
| JP200526031A |
Attorney, Agent or Firm:
Atsushi Aoki
Koichi Itsubo
Higuchi Souji
Masami Enohara
Ryu Kobayashi
Koichi Itsubo
Higuchi Souji
Masami Enohara
Ryu Kobayashi