Title:
多層プリント回路基板の製造方法
Document Type and Number:
Japanese Patent JP4892798
Kind Code:
B2
Inventors:
Shinichiro Bamba
Koichi Ishida
Koichi Ishida
Application Number:
JP2001243856A
Publication Date:
March 07, 2012
Filing Date:
August 10, 2001
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/28; H05K3/46; H05K3/22
Domestic Patent References:
| JP4334095A | ||||
| JP6013807A | ||||
| JP2022894A |
Attorney, Agent or Firm:
Masahiro Okada