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Title:
半導体装置の作製方法
Document Type and Number:
Japanese Patent JP4896416
Kind Code:
B2
Abstract:

To provide a semiconductor device in which elements of different structures are formed on the same substrate while reducing the number of steps in view of the fact that fabricating elements of different structures and different characteristics on the same substrate at the same time increases the number of steps, resulting in a complicated process, and to provide a manufacturing process therefor.

High-speed transistors and highly resistant transistors are efficiently manufactured in response to a memory transistor that requires the largest number of steps during formation of elements among the elements that constitute a semiconductor device. This enables manufacturing a less expensive semiconductor device in which an increase in the number of steps is suppressed.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Tetsuji Yamaguchi
Kiyoshi Kato
Application Number:
JP2005061959A
Publication Date:
March 14, 2012
Filing Date:
March 07, 2005
Export Citation:
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Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G06K19/07; H01L27/115; G06K19/077; H01L21/8247; H01L27/10; H01L29/788; H01L29/792
Domestic Patent References:
JP11087545A
JP9148458A
JP2003249579A
JP2003518742A



 
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