Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP4897033
Kind Code:
B2
Inventors:
Kitamura Shoji
Tetsuya Sueda
Hiroshi Hayashi
Tetsuya Sueda
Hiroshi Hayashi
Application Number:
JP2009273126A
Publication Date:
March 14, 2012
Filing Date:
December 01, 2009
Export Citation:
Assignee:
Canon Machinery Inc.
International Classes:
H01L21/52
Domestic Patent References:
JP4035095A | ||||
JP9232342A | ||||
JP2009004557A | ||||
JP2006324598A |
Attorney, Agent or Firm:
Hideka Tanaka
Kunihiko Shiromura
Tsuyoshi Kumano
Yasumitsu Tate
Kunihiko Shiromura
Tsuyoshi Kumano
Yasumitsu Tate