Title:
正孔注入輸送層形成用材料、及びその製造方法
Document Type and Number:
Japanese Patent JP4900533
Kind Code:
B1
Abstract:
The present invention is to provide a device having an easy production process and capable of achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer contains a reaction product of a molybdenum complex or tungsten complex.
Inventors:
Shigehiro Ueno
Masato Okada
Keisuke Hashimoto
Masato Okada
Keisuke Hashimoto
Application Number:
JP2011229823A
Publication Date:
March 21, 2012
Filing Date:
October 19, 2011
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L51/50; H05B33/10
Domestic Patent References:
| JP200331366A | ||||
| JP2005206925A | ||||
| JP200624791A | ||||
| JP2002151257A | ||||
| JP2008251626A |
Attorney, Agent or Firm:
Kishimoto Tatsuto
Akihiko Yamashita
Akihiko Yamashita