Title:
電子基板の防湿処理方法
Document Type and Number:
Japanese Patent JP4901888
Kind Code:
B2
Inventors:
Yuichi Maeda
Kanzaki Shozo
Kanzaki Shozo
Application Number:
JP2009019982A
Publication Date:
March 21, 2012
Filing Date:
January 30, 2009
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/00; H05K3/28
Domestic Patent References:
| JP11238836A | ||||
| JP2000124344A | ||||
| JP2006019452A | ||||
| JP2000332057A | ||||
| JP8032214A | ||||
| JP8083868A | ||||
| JP2006041326A |
Attorney, Agent or Firm:
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami