Title:
半導体基板の洗浄及び乾燥システム及びそれを利用した洗浄及び乾燥方法
Document Type and Number:
Japanese Patent JP4903992
Kind Code:
B2
Abstract:
A system for cleaning and drying semiconductor wafers improves device yield by providing more advanced control of the ratio of drying fluid to cleaning fluid, for example the ratio of N2 vapor to IPA vapor. In addition, a quick drain process is employed to improve process throughput, and to further improve particle and watermark removal during the cleaning and drying steps.
Inventors:
Park Kimaru
Song Bell Country
So Sim Gen
So So Australia
Lee Zhen
Hiroshi Hayashi
So East Go
Song Bell Country
So Sim Gen
So So Australia
Lee Zhen
Hiroshi Hayashi
So East Go
Application Number:
JP2004311059A
Publication Date:
March 28, 2012
Filing Date:
October 26, 2004
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L21/027; H01L21/304; H01L21/00; H01L21/02; H01L21/302; H01L21/46
Domestic Patent References:
| JP9246231A | ||||
| JP11162923A | ||||
| JP10289895A | ||||
| JP2000279898A | ||||
| JP2000055543A |
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Etsuko Saito
Katsuyuki Utani
Toshifumi Fujii
Yasuo Nara
Etsuko Saito
Katsuyuki Utani
Toshifumi Fujii