Title:
ウエハ加工用テープ
Document Type and Number:
Japanese Patent JP4904432
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To inhibit separation of an adhesive layer from a pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape.SOLUTION: In a wafer processing tape, a peel force at a periphery 32 of an adhesive layer 3 is larger than a peel force at a bonding scheduled part 30 of the adhesive layer 3 on which a semiconductor wafer is scheduled to be bonded. In the case where the peel force at the bonding scheduled part 30 is not less than 0.01 N/inch and less than 0.4 N/inch, the peeling force at the periphery 32 is over 30 times the peeling force at the bonding scheduled part 30 or not less than 0.9 N/inch, whichever is smaller. In the case where the peeling force at the bonding scheduled part 30 is not less than 0.4 N/inch and less than 0.9 N/inch, the peeling force at the periphery 32 is not less than 0.9 N/inch.
Inventors:
Inomae Chikako
Kunihiko Ishiguro
Kunihiko Ishiguro
Application Number:
JP2011043504A
Publication Date:
March 28, 2012
Filing Date:
March 01, 2011
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/02; H01L21/52
Domestic Patent References:
| JP2004356412A | 2004-12-16 | |||
| JP2011162699A | 2011-08-25 | |||
| JP2005085827A | 2005-03-31 | |||
| JP2010098088A | 2010-04-30 | |||
| JP2011023692A | 2011-02-03 |
Foreign References:
| WO2008044349A1 | 2008-04-17 |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune