Title:
電子部品内蔵基板および電子部品内蔵基板の製造方法
Document Type and Number:
Japanese Patent JP4906462
Kind Code:
B2
Abstract:
A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent additive ratios an additive material for adjusting hardness; a second conductive pattern formed on the insulating layer; and a conductive post for connecting the first conductive pattern to the second conductive pattern.
Inventors:
Koji Yamano
Machida Hirohiro
Machida Hirohiro
Application Number:
JP2006277896A
Publication Date:
March 28, 2012
Filing Date:
October 11, 2006
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46; H01L23/12; H05K3/18
Domestic Patent References:
| JP2006261246A | ||||
| JP2006041438A | ||||
| JP2004086833A1 | ||||
| JP2000301534A | ||||
| JP2004221417A | ||||
| JP2006196785A | ||||
| JP61133696A | ||||
| JP1225196A |
Foreign References:
| WO2004086833A1 |
Attorney, Agent or Firm:
Tadahiko Ito