Title:
電子回路の製造方法
Document Type and Number:
Japanese Patent JP4909283
Kind Code:
B2
Abstract:
The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).
Inventors:
Wolfgang Jakob
Christophe roof
Albert-Andreas Hebel
Rolf Becker
Christophe roof
Albert-Andreas Hebel
Rolf Becker
Application Number:
JP2007548799A
Publication Date:
April 04, 2012
Filing Date:
November 28, 2005
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
H01L25/04; H01L21/60; H01L25/18
Domestic Patent References:
| JP52148045U | ||||
| JP5260269U |
Foreign References:
| WO2004034428A2 |
Attorney, Agent or Firm:
Takuya Kuno
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard