Title:
半導体集積回路用ソケット
Document Type and Number:
Japanese Patent JP4911495
Kind Code:
B2
Abstract:
An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.
Inventors:
Naohiro Takagi
Application Number:
JP2006135188A
Publication Date:
April 04, 2012
Filing Date:
May 15, 2006
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
G01R1/073; G01R31/26; H01R13/24; H01R33/76
Domestic Patent References:
| JP2005249448A | ||||
| JP9129774A | ||||
| JP11086992A |
Foreign References:
| US7053496 |
Attorney, Agent or Firm:
Minoru Kudo