Title:
導電性回路基板の製造方法
Document Type and Number:
Japanese Patent JP4920401
Kind Code:
B2
Abstract:
A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.
Inventors:
Takashi Shoji
Sakai Takekazu
Sakai Takekazu
Application Number:
JP2006351003A
Publication Date:
April 18, 2012
Filing Date:
December 27, 2006
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H05K3/34
Domestic Patent References:
| JP2006278650A | ||||
| JP2005174828A |
Attorney, Agent or Firm:
Yukio Uchida
Minoru Terada
Minoru Terada