Title:
光センサを実装するための方法
Document Type and Number:
Japanese Patent JP4925832
Kind Code:
B2
Abstract:
An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
Inventors:
Siu, Hey Min
Butterfly, Wai Won
Lee, Come Phi
Butterfly, Wai Won
Lee, Come Phi
Application Number:
JP2006549338A
Publication Date:
May 09, 2012
Filing Date:
January 03, 2005
Export Citation:
Assignee:
Intellectual Ventures Second LRC
International Classes:
H01L31/02; H01L21/44; H01L21/48; H01L23/02; H01L23/495; H01L31/0203
Domestic Patent References:
| JPH1174555A | 1999-03-16 |
Foreign References:
| US6822326B2 | 2004-11-23 |
Attorney, Agent or Firm:
Kenji Sugimura