Title:
接合方法
Document Type and Number:
Japanese Patent JP4927391
Kind Code:
B2
Abstract:
The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.
Inventors:
Shinjiro Watanabe
Application Number:
JP2005340891A
Publication Date:
May 09, 2012
Filing Date:
November 25, 2005
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B23K20/10; B23K20/24; B23K101/36
Domestic Patent References:
| JP2001205452A | ||||
| JP2004317162A | ||||
| JP57078720A | ||||
| JP5322463A | ||||
| JP8309562A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Miaki Kametani
Koji Hagiwara