Title:
半導体装置
Document Type and Number:
Japanese Patent JP4931411
Kind Code:
B2
Inventors:
Mori Shigeyasu
Application Number:
JP2005359386A
Publication Date:
May 16, 2012
Filing Date:
December 13, 2005
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L29/786; H01L21/20; H01L21/336; H01L21/8238; H01L27/08; H01L27/092
Domestic Patent References:
| JP6029476A | ||||
| JP2005251794A | ||||
| JP8125028A |
Attorney, Agent or Firm:
Seiji Okuda