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Title:
SOI基板の製造方法
Document Type and Number:
Japanese Patent JP4934966
Kind Code:
B2
Inventors:
遠藤 昭彦
草場 辰己
奥田 秀彦
森田 悦郎
Application Number:
JP2005028502A
Publication Date:
May 23, 2012
Filing Date:
February 04, 2005
Export Citation:
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Assignee:
株式会社SUMCO
International Classes:
H01L27/12; H01L21/02
Domestic Patent References:
JP2000124092A
JP2000294754A
JP2004311526A
JP2002503400A
JP2004259970A
Attorney, Agent or Firm:
須田 正義



 
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