検査方法及び検査装置 - Panasonic Corporation

Title:

検査方法及び検査装置

Document Type and Number:

Japanese Patent JP4955949

Kind Code:

B2

Abstract:

To provide an inspection method and an inspection device capable of inspecting accurately the junction part of a semiconductor device with a semiconductor element flip-chip mounted on a substrate by jointing bumps provided on an electrode.

In this inspection method/inspection device, the semiconductor element 1 is heated by self-heating of the semiconductor element 1 by impressing a current from a heating means 6, the temperature distribution on a reverse face of the bump 3 jointing face in the semiconductor element 1 is measured by a measuring means 7 by using heat radiation, through the bumps 3 of the heat heated by the semiconductor element 1, and measured data are compared with the data of a nondefectives by a determination means 8, to accurately determine the quality of a jointing state of the bumps 3.

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Inventors:

Kazunori Kuzuhara
Takanori Akeda
Shigenari Takami
Ryoji Yokotani
Shimoda Norikazu

Application Number:

JP2005203525A

Publication Date:

June 20, 2012

Filing Date:

July 12, 2005

Export Citation:

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Assignee:

Panasonic Corporation

International Classes:

G01N25/72; G01J5/48; G01R31/02; G01R31/26

Domestic Patent References:

JP11201926A
JP2003279514A

Attorney, Agent or Firm:

Keisei Nishikawa
Mizuhiji Katsuhisa
Takeshi Sakaguchi
Hidetoshi Kitade

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Next Patent: JPS4955950