Title:
印刷回路基板ストリップ及び電子素子内蔵型印刷回路基板の製造方法
Document Type and Number:
Japanese Patent JP4977235
Kind Code:
B2
Abstract:
A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.
Inventors:
Fri sentence Sun
Chung Chestnut Teaching
Park Hua Sen
Chung Chestnut Teaching
Park Hua Sen
Application Number:
JP2010132022A
Publication Date:
July 18, 2012
Filing Date:
June 09, 2010
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K1/02; H01L23/12; H05K3/00; H05K3/46
Domestic Patent References:
| JP200735689A | ||||
| JP9509532A | ||||
| JP2003188480A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Masakazu Ito