Title:
感光性絶縁樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP4983798
Kind Code:
B2
Abstract:
An object of the present invention is to provide a cured product which is excellent in characteristics such as an electric insulation property, a heat impact resistance, an adhesive property and the like and to provide a photosensitive insulation resin composition from which the above cured product can be obtained and which is suited to uses such as an interlayer insulation film, a surface protecting layer and the like in semiconductor elements. The photosensitive insulation resin composition according to the present invention is characterized by comprising (A) a copolymer comprising 10 to 99 mole % of a constitutional unit (A1) represented by the following Formula (1) and 90 to 1 mole % of a constitutional unit (A2) represented by the following Formula (2) (provided that the total of all constitutional units constituting the above copolymer (A) is 100 mole %): (wherein R1 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R2 represents a hydrogen atom or methyl; m is an integer of 1 to 3, and n is an integer of 0 to 3; and m+n<=5; R3 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R4 represents a hydrogen atom or methyl; and k is an integer of 0 to 3), (B) a compound (B1) having an oxetanyl group, (C) a photosensitive acid generator, (D) a solvent and (F) cross-linked fine particles.
Inventors:
Atsushi Ito
Hirofumi Goto
Hirofumi Sasaki
Hirofumi Goto
Hirofumi Sasaki
Application Number:
JP2008531996A
Publication Date:
July 25, 2012
Filing Date:
July 23, 2007
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/038; G03F7/004; G03F7/075; H01L21/027
Domestic Patent References:
| JP11065116A | ||||
| JP11060683A | ||||
| JP10010733A | ||||
| JP11282162A | ||||
| JP2006179423A | ||||
| JP2003215802A |
Attorney, Agent or Firm:
Patent corporation ssinpat
Koji Makimura
Chihata Takahata
Koji Makimura
Chihata Takahata