Title:
固定装置を備えたパワー半導体モジュール
Document Type and Number:
Japanese Patent JP4989941
Kind Code:
B2
Inventors:
Jürgen Steger
Frank Eversberger
Frank Eversberger
Application Number:
JP2006221519A
Publication Date:
August 01, 2012
Filing Date:
August 15, 2006
Export Citation:
Assignee:
SEMIKRON Elektronik GmbH & Co.KG
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2004319992A | ||||
| JP6315925A | ||||
| JP2001036005A | ||||
| JP2003031738A |
Foreign References:
| US5107074 |
Attorney, Agent or Firm:
Fujita Akira