Title:
積層基板の製造方法
Document Type and Number:
Japanese Patent JP4992310
Kind Code:
B2
Abstract:
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
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Inventors:
Takashi Nakagawa
Seiichi Sugano
Kenji Iida
Maehara Yasutomo
Hitoshi Suzuki
Kaoru Sugimoto
Kenji Fukuzono
Takashi Sugada
Hitoshi Date
Tomohisa Yagi
Seiichi Sugano
Kenji Iida
Maehara Yasutomo
Hitoshi Suzuki
Kaoru Sugimoto
Kenji Fukuzono
Takashi Sugada
Hitoshi Date
Tomohisa Yagi
Application Number:
JP2006166995A
Publication Date:
August 08, 2012
Filing Date:
June 16, 2006
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/36
Domestic Patent References:
| JP2005353861A | ||||
| JP2004010828A | ||||
| JP2002530900A | ||||
| JP2003204148A | ||||
| JP7086748A | ||||
| JP54144970A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu