Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
半導体チップの製造方法および使用方法
Document Type and Number:
Japanese Patent JP4994147
Kind Code:
B2
Inventors:
佐藤 孝太郎
Application Number:
JP2007205319A
Publication Date:
August 08, 2012
Filing Date:
August 07, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
日本インター株式会社
International Classes:
H01L29/868; H01L29/861
Domestic Patent References:
JP10256574A
JP2002033326A
JP2000312012A
JP2022869A
JP63313859A
JP2001257211A
Attorney, Agent or Firm:
榊原 弘造



 
Previous Patent: JPS4994146

Next Patent: JPS4994148