Title:
半導体チップの製造方法および使用方法
Document Type and Number:
Japanese Patent JP4994147
Kind Code:
B2
Inventors:
Kotaro Sato
Application Number:
JP2007205319A
Publication Date:
August 08, 2012
Filing Date:
August 07, 2007
Export Citation:
Assignee:
Nippon Inter Co., Ltd.
International Classes:
H01L29/868; H01L29/861
Domestic Patent References:
| JP10256574A | ||||
| JP2002033326A | ||||
| JP2000312012A | ||||
| JP2022869A | ||||
| JP63313859A | ||||
| JP2001257211A |
Attorney, Agent or Firm:
Kozo Sakakibara