Title:
電子部品用接着テープ
Document Type and Number:
Japanese Patent JP5004499
Kind Code:
B2
Abstract:
The adhesive tape for electronic parts provided in the present invention is an adhesive tape having a thermally cured adhesive layer provided on at least one surface of an insulation film, wherein a shear adhesive strength with respect to a copper plate of said thermally cured adhesive layer at 160 DEG C heating is equal to or more than 20N/cm2 while being measured with a tensile speed of 20mm/min, and a ratio (a/b) of the shear adhesive strength (a) at the tensile speed of 20mm/min to a shear adhesive strength (b) at a tensile speed of 50mm/min is 0.8 to 1.0.
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Inventors:
Tochihira order
Shimizu Courage
Tatsudome Iwabuchi
Shimizu Courage
Tatsudome Iwabuchi
Application Number:
JP2006124466A
Publication Date:
August 22, 2012
Filing Date:
April 27, 2006
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C09J7/02; C09J109/02; C09J163/00; H01L21/52; H01L21/60; H01L23/50
Domestic Patent References:
| JP364387A |