フィルム状回路接続材料 - Hitachi Chemical Co., Ltd.

Title:

フィルム状回路接続材料

Document Type and Number:

Japanese Patent JP5009430

Kind Code:

B2

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Inventors:

Toshiyuki Yanagawa
Mitsugu Fujinawa
Kyohisa Ota

Application Number:

JP2011174534A

Publication Date:

August 22, 2012

Filing Date:

August 10, 2011

Export Citation:

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C09J7/00; C09J11/06; C09J163/00; C09J171/10; H01B1/20; H01B5/16; H01R11/01

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Hiroto Kido
Masato Ikeda

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