Title:
脆性材料基板の加工方法
Document Type and Number:
Japanese Patent JP5011048
Kind Code:
B2
Inventors:
Atsushi Imura
Application Number:
JP2007252093A
Publication Date:
August 29, 2012
Filing Date:
September 27, 2007
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; C03B33/09; C04B41/80; H01L21/301
Domestic Patent References:
| JP2005212473A | ||||
| JP200790860A | ||||
| JP2001151525A | ||||
| JP200755000A |
Foreign References:
| WO2004014625A1 | ||||
| WO2006002168A1 | ||||
| WO2005102638A1 | ||||
| WO2004083133A2 | ||||
| WO2003010102A1 | ||||
| WO2006038565A1 |
Attorney, Agent or Firm:
Yoshio Kashima