接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置

Title:

接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置

Document Type and Number:

Japanese Patent JP5011599

Kind Code:

B2

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Inventors:

Katogi Shigeki
Toshiyuki Yanagawa
Yuko Mochida
Masami Yusa

Application Number:

JP2000150762A

Publication Date:

August 29, 2012

Filing Date:

May 23, 2000

Export Citation:

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C09J163/00; C09J11/08; C09J201/06; H01L21/52

Domestic Patent References:

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu

Previous Patent: JPS5011598

Next Patent: JPS5011600